Bozhon Semiconductor: Committed to becoming a leader of precision mounting and inspection equipment

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AOI Inspection Machine

CesiStar-TV6-15T

The TV6-15T AOl Inspection System is mainly used in productfields such as OFN, OFP, and FCBGA. lt provides six-side opticalinspection for chips with high accuracy and efficiency.

High Compatibility
High-Speed Inspection and Sorting
Advanced Inspection Capabilities
High Usability

Application Scenarios

QFP/SOP
LGA
FCBGA/CSP/WLP
QFN
POP

A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The MicroStar EF8622 die bonder is based on Bozhon semiconductor die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible MicroStar EF8622 is ideally suited for a range of markets and applications.

QFP/SOP

LGA

FCBGA/CSP/WLP

QFN

POP

Defect Inspection Range

2D/3D/Ball/Lead/Pad Measurement

LID Warpage
LID Gap
Side Inspection
PoP Inspection
Capacitor Damage
Capacitor Damage

Surface Defect Inspection

Cracks
Chipping
Copper Exposure
Microcracks
Voids

Optional Specialized Inspection ltems

Scratches
Coplanarity
Coplanarity
Foot Angle
Solder Ball Damage

Product Parameters

3D Inspection Accuracy

7.5μm

Chip Size

2x2mm-68x68mm

Supported Chip Package Types

BGA/QFN/QFP

FEATURES

Bozhon Semiconductor MicroStar Eutectic Die Bonder excels in high-rate optical module device placement scenarios, and can effectively solve the pain points of optoelectronic placement: