High Speed High Precision Epoxy Die Bonder
FastStar-DU9721
The DU9721 die bonder achieves placement accuracy of ±7μm@3σ through selfdeveloped motioncontrol technology. Byintegrating dispensing, automatic tool changing, die bonding, and other functionsthe equipment is compatible with wafers of various sizes. lts open architecture and modular designprovides extreme efficiency and on-demand customization capabilities for customers.
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High Precision -
High Flexibility -
Multi-Functionality -
Modular Design
Application
Scenarios
A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The MicroStar EF8622 die bonder is based on Bozhon semiconductor die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible MicroStar EF8622 is ideally suited for a range of markets and applications.
IC Chips
Electronic Modules
Power semiconductor
Product
Parameters
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X/Y Placement Accurac±7μm
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Theta (θ) Placement Accurac±0.2°
FEATURES
Bozhon Semiconductor MicroStar Eutectic Die Bonder excels in high-rate optical module device placement scenarios, and can effectively solve the pain points of optoelectronic placement:
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High Precision -
High Flexibility -
Integrated Multi-Functionality -
Modular Design
High Precision
Meeting micron-level placement accuracy requirements,enabling exceptional bonjing efficiency
High Flexibility
Supporting various material feeding methods,compatible with die bonding, SiP, UV curing,and other packaging processes.
Integrated Multi-Functionality
Compatible with die bonding and
multi-chip packaging.
Modular Design
Meets the development needs ofdifferent
product categories, allows flexible customization
based on customer requirements.
Consult with our technology specialists. Consulting & support where you need them.
Bozhon semiconductor experts are here to help you.
Bozhon semiconductor experts are here to help you.
Discover how we
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