
Fully Automatic High Precision Eutectic Die Bonding Machine
MicroStar-EH9722
The EH9722 eutectic die bonder provides versatile die bonding solutions, support.ing both process verification and development during the R&D phase as well asmass production for a variety of packaging scenarios. lt is widely applicable toprocesses such as COC, COB, COS, and Flipchip, and provides modular configura.tions to meet different production requirements.
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High precision -
High efficiency -
High flexibility -
High expandability
Application
Scenarios
A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The MicroStar EF8622 die bonder is based on Bozhon semiconductor die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible MicroStar EF8622 is ideally suited for a range of markets and applications.
Product
Parameters
- Placement accuracy±1.5μm @ 3σ
- Placement processEutectic/UV Adhesive dipping
- Efficiency25-35s(Eutectic)12-15s (Adhesivedipping)

FEATURES
Bozhon Semiconductor MicroStar Eutectic Die Bonder excels in high-rate optical module device placement scenarios, and can effectively solve the pain points of optoelectronic placement:
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High Precision -
High Efficiency of Eutectic -
Intelligent Design -
Dual View Module
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