ABOUT
BOZHON
SEMICONDUCTOR
Committed to becoming a leader of precision mounting and inspection equipment
From Lab to Fab cutting-edge assembly and testing machines serving requirements in R&D and all the way through to high-volume production.
FOCUSING ON
SEMICONDUCTORS
Suzhou Bozhon Semiconductor Co., Ltd. is a wholly-owned subsidiary of Bozhon Precision Technology Co., Ltd. (stock code: 688097), relying on Bozhon Precision Technology's more than 20 years of technological accumulation and focusing on semiconductors.
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4,000M²Production base area -
10+Global regional layout -
60%Ratio of R&D personnel -
30+Patent Certification
Discoverproducts and
Solutions
The full gamut of process capability captured within a suite of innovative machine systems, all controlled by an advanced software interface.
The MicroStar Series is a series of leading multifunctional Die Bonding Machine Equipments with high efficiency ... (12-50s/pcs) and
The FastStar series die bonder is a high-speed and high-precision equipment for multi-chip packaging, with a placement accuracy of ±7μm@3σ. It adopts an open architecture and modular design, providing on-demand customization capabilities for ultimate efficiency. It is compatible with up to 12-inch wafers and meets packaging processes such as die bonding, SiP, and UV curing.
The CeciStar Series A0l lnspection machine provides high performance, fully automated optical inspectionof packaged integrated circuit(IC) components. lt leverages high sensitivity with 2D/3D inspection andmeasurements to determine final package quality for a wide range of device types and sizes.
INDUSTRY
APPLICATION
Empowering your innovations with advanced application and automation solutions.
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Photoelectron -
Laser -
Sensor -
Power Semiconductors -
Microwave Radio Frequency -
Semiconductor Inspection
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