Application
Power Semiconductors
Power semiconductor applications cover all areas of the electronic industry chain, with the rapid development of new energy vehicles, new energy and other industries, the scale of power semiconductor industry will gradually increase, IGBT, the third generation of power semiconductor will be the fastest growing field.
The
Challenge
The mounting of power semiconductor chips is a key link that affects the performance, reliability and cost of the devices. Power semiconductor chips will produce a lot of heat when working, if not timely heat dissipation will affect the performance and life of the chip, the device packaging technology must have a good heat dissipation effect, traditional packaging materials and technology are subject to great limitations to meet the needs of high temperature applications.
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Consider the key requirements of the actual production process and alignment -
High precision pick and fit requirements -
Multiple chip bonding technologies (epoxy, eutectic, dipping) -
Patch efficiency needs to be cost-effective -
Modular design, can meet the diversified functional needs of customers
Our Recommendation
To address the stringent requirements of thermal performance, structural reliability, and high-temperature endurance in power semiconductor packaging, Bozhon Semiconductor provides a high-precision die bonding solution for IGBT, SiC, and GaN devices.
The FastStar DU9721 High-Speed, High-Precision Die Bonder integrates multi-chip parallel bonding and intelligent process control, combining micron-level placement accuracy with high production efficiency. It ensures stable chip-to-substrate interconnection and uniform heat dissipation, supporting diverse package types and high-power applications — enabling high-performance, reliable manufacturing for electric vehicles and power electronics.
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