On October 14, 2026, Fiber Optic Online reported that as computing power becomes the new infrastructure, optical modules are undergoing an unprecedented "super expansion cycle." From 400G to 800G, and then to 1.6T, 3.2T, and even NPO/CPO, every leap in speed is driving upstream packaging equipment to upgrade toward higher precision, greater stability, and higher production yield. In this industrial transformation driven by AI, Bozhong Semiconductor, as a subsidiary of Bozhong Precision, has spent six years evolving from a single-machine equipment supplier to a solution provider of automated packaging system solutions for optical communications.

At this year's CIOE, we interviewed Mr. Fu Jiangbo, R&D Director of Bozhong Semiconductor, and exchanged views around a core question: How has Bozhong Semiconductor managed to have its orders scheduled through the end of 2027?

 △ Group photo of Fiber Online and Bozhong Semiconductor team

Six years of deep cultivation in optical communications: from a single eutectic machine to a full-stack layout in optical module manufacturing

In 2020, when AI large models had not yet exploded and the optical module industry was still in the stage of 400G gradually entering commercial use and 800G beginning preliminary research, Bozhon Precision made a decision that seemed quite "ahead of its time" back then: strategically positioning itself in the core equipment for optical modules—high-precision die bonders—and officially launching core technology R&D in this field.

In 2020, Bozhon Precision officially launched its strategic布局 in the high-precision chip mounter sector, initiated core technology R&D, and completed prototype development.

In 2021, Bozhon Precision introduced its chip mounter equipment to leading enterprises for validation, achieving small-batch deliveries.

In 2022, Bozhon Semiconductor, a directly controlled subsidiary of Bozhon Precision, was officially established. The first batch of chip mounter equipment achieved volume deliveries, and the fully automatic high-precision eutectic die bonder DB3000 was officially launched into mass production.

In 2023, Bozhon Semiconductor's Star Series EH9721 eutectic die bonder passed rigorous technical validation from international customers and completed deliveries for multiple overseas projects, marking the official entry of Bozhon Precision's optical communication equipment into the global supply chain.

In 2024, Bozhon Semiconductor focused on developing automated assembly lines and completed overseas project deliveries. Its eutectic/die bonding equipment has been applied on a large scale in the mass production of 400G/800G high-speed optical modules, successfully entering the supply chains of leading domestic and international enterprises and being exported overseas.

In 2025, Bozhon Semiconductor successively launched multiple eutectic/die bonding machines covering different application scenarios.

In 2026, Bozhon Precision officially completed the strategic acquisition of Hunan Zhongnan Hongsi Automation Technology Co., Ltd., incorporating optical automatic alignment technology into its service matrix, achieving key process coverage from "die bonding" to "die bonding + active alignment + automated assembly." In the same year, Zhongnan Hongsi's second delivery center in Changsha commenced production, not only compressing the delivery cycle for batch orders to as short as 1.5 months, but also successfully securing customer orders for NPO and CPO OE automatic alignment equipment, with the relevant equipment having been progressively delivered.

From single machines to complete production lines, from die bonding to coupling, from domestic to overseas markets, and from pluggable modules to CPO—every step Bozhon Precision has taken aligns with the rhythm of industry evolution. Behind this lies the company's firm conviction that "optical module manufacturing will ultimately move toward large-scale, standardized, and automated production."

From "Single Device" to "Full-Line Automation": What Problems Does a Full-Line Solution Actually Solve

In 2026, Bozhon Precision acquired Zhongnan Hongsi, marking a key turning point in the company's optical communication whole-line business.

Prior to this, Bozhon Precision had already developed mature capabilities in the mounting, testing, and assembly stages of optical modules. With the addition of Zhongnan Hongsi, Bozhon Precision officially completed its upgrade from a "core equipment supplier" to a "service provider of automated system solutions for optical communication packaging."

But from the customer's perspective, what is the core difference between choosing Bozhon Precision's complete line solution versus purchasing standalone equipment from different manufacturers separately?Fang Jiangbo, the R&D Director, gave a simple yet powerful answer: "The company's complete line solution has become a competitive advantage that sets us apart from peers."

Expanding on this, the difference is reflected in three aspects:

First, the integration of the process chain. Optical module packaging involves multiple critical processes such as chip mounting, optical coupling, automated assembly, and testing. If these processes are completed by equipment from different manufacturers, the interface protocols, data formats, and node matching between equipment need to be coordinated by the customer themselves, and a bottleneck in any link will drag down the efficiency of the entire production line. Bozhon Precision's whole-line solution incorporates die bonding, coupling, assembly, and testing into a unified technical system, eliminating the "equipment incompatibility" problem from the source.

Second, adaptability for stable mass production and delivery. R&D Director Fu Jiangbo emphasized: "To ensure the stable mass production and delivery of standardized products, especially for major manufacturers expanding into overseas markets, they tend to prefer overall system automation solutions." This judgment hits the core pain point of the current optical module industry—after the explosion in AI computing power demand, orders from leading optical module manufacturers have shifted from "small batch, multiple varieties" to "large batch, standardized." What customers need is an automated production line that requires minimal manual intervention, maintains continuous stability, and achieves high yield in delivery.

Third, being accountable for capacity and yield. A whole-line solution means a single responsible entity. When problems arise on the production line, customers do not need to communicate back and forth among multiple equipment suppliers or define responsibility. As the whole-line provider, Bozhon Precision is responsible for the final capacity, yield, and delivery cycle.This whole-line automation model is particularly valuable for leading domestic optical module manufacturers that are rapidly building factories in Southeast Asia, Mexico, and other regions.

At present, Bozhon Precision already possesses the complete closed-loop capability for full-process automation of optical modules and is able to provide global customers with an integrated flexible solution from chip mounting and optical coupling to automated assembly and testing.

1+1>2: Synergy after acquisition is more than just a technological overlay

Bozhong Precision's integration of Bozhong Semiconductor and Zhongnan Hongsi is not merely a business combination, but a strategic reinforcement.Fu Jiangbo, R&D Director, emphasized: "At present, it is a multi-dimensional upgrade. First, the two companies are aligned in direction and share the same customer base in the optical module field, and their team capabilities and product lines are complementary. This complementarity is most directly reflected in two dimensions—technology and after-sales service."Technological synergy: The positioning accuracy of the die bonder and the alignment algorithm of the coupling machine form a closed data loop, and in the future, software-hardware integration will be achieved to create a dynamically adjustable integrated process unit.After-sales synergy: Relying on a unified global service network, customers need only a single point of contact to receive full-process support.

The most direct validation came in 2026, when Zhongnan Hongsi, backed by its core strength in micro-nano precision, successfully secured orders from customers for NPO and CPO OE automatic coupling equipment. The rapid landing of these orders was inseparable from the support of Bozhong Precision's brand endorsement, customer resources, and supply chain system in the semiconductor equipment field.

At present, the relevant equipment has completed design and is about to enter the formal delivery stage, marking a milestone step in Bozhong Precision's implementation in high-end automation scenarios.

Another signal worth noting: in July 2026, Zhongnan Hongsi once again won a first-class provincial technological invention award. This award is not only recognition of Zhongnan Hongsi's original technological accumulation, but also confirms the continuous empowerment Bozhong Precision has provided in R&D investment and technological innovation since acquiring Zhongnan Hongsi.

Orders scheduled through 2027: With full-capacity operation, how to maintain delivery and yield ratesThe explosion of AI computing power has brought an unprecedented wave of orders to the optical module equipment industry.According to reports, Bozhong Precision's optical communication equipment orders are already scheduled through 2027, with production workshops and the supply chain operating at full capacity.

As of the end of June 2026, Bozhong Precision's on-hand order value reached RMB 9.568 billion, laying a solid foundation for steady growth in full-year performance.Against the backdrop of surging orders, a sharp question is posed: how will Bozhong Precision ensure delivery speed and stability of equipment yield rates?

Confidence 1: Large-Scale Delivery Experience in Consumer Electronics Production Lines“In essence, Bozhon Precision delivers in large volumes every year in consumer electronics, so we possess strong capabilities and experience in design, production, and quality control.” The response from Fu Jiangbo, R&D Director, reveals the core confidence behind its ability to handle waves of orders.The experience of delivering large volumes of automation equipment annually means that Bozhon Precision has established a mature operational mechanism, achieving design standardization, streamlined production processes, and a systematic quality control framework. This mechanism, migrated from the consumer electronics sector to the optical communications sector, enables Bozhon Precision to rapidly scale up production without compromising quality when faced with surges in orders.

Confidence 2: Production Capacity Expansion of the Second Delivery CenterTo address the rapidly growing demand for high-speed optical modules, especially those operating at 800G and 1.6T rates, the second delivery center of Zhongnan Hongsi was successfully put into operation in 2026. The launch of this delivery center has significantly increased the production capacity of optical coupling equipment, shortening the fastest batch order delivery cycle to 1.5 months, thereby helping customers achieve larger-scale mass production.

Confidence 3: Full-Chain Quality Control SystemBoozon Precision's quality control capabilities span the entire chain, from design, procurement, and production to delivery. During the design phase, modular design and standardized interfaces reduce production complexity. During procurement, the company's scale advantages ensure a stable supply of core components. During production, strict process flows and online inspection guarantee consistency across every machine. During delivery, comprehensive pre-shipment testing and on-site installation and commissioning at customer facilities ensure that equipment meets expected performance.

"Boozon Precision has a sizable professional team in the automation field and continues to invest in both software and hardware." A large R&D team means Boozon Precision is capable of advancing R&D across multiple technical directions simultaneously—from eutectic die bonding to optical coupling, from standalone equipment to full-line automation, and from pluggable modules to CPO—forming a multi-track technology development layout.

For 1.6T, 3.2T, and CPO: The "arms race" at the device end has already begun

The pace of technological iteration in the optical module industry is exceeding many people's expectations. 800G is still in a period of rapid growth, 1.6T has entered mass production, R&D efforts for 3.2T are in full swing, and NPO/CPO is regarded as the next-generation data center optical interconnect solution. In the technical route competition between NPO and CPO, what differentiated preparations does the equipment side need to make?

R&D Director Fu Jiangbo stated: "The large-scale introduction of flip-chip technology is the most direct challenge that CPO packaging poses to the equipment side." The flip-chip process requires chips to interconnect with the substrate via microbumps in a face-down manner, with placement accuracy typically needing to reach sub-micron levels, and extremely stringent control over coplanarity, pressure control, and reflow profiles.

This means that traditional equipment designed for eutectic die bonding must undergo comprehensive upgrades in motion control, machine vision, process systems, and other areas.In response to this trend, Bozhon Precision Industry has fully launched the R&D of its next-generation eutectic die bonder, conducting product pre-research and technology reserves for the evolution of 1.6T, 3.2T, and CPO technologies.With 1.6T mass production imminent and NPO/CPO drawing closer, the "arms race" in optical communication packaging equipment has only just begun. Bozhon Precision Industry is already positioned well, but whether it can maintain its lead in the next generation of evolution, truly take root in overseas markets, and uphold quality standards amid a surge in orders — these questions require time to answer.

But at least now, Bozhon Precision's six years of accumulated experience has provided a "Chinese solution" for optical communication manufacturing.