Under the AI computing power wave, optical module manufacturing enters the "rapid delivery" era.
Driven by the AI computing power surge, optical modules are accelerating their evolution from 800G to 1.6T. The manufacturing sector is under triple pressure: high-frequency iteration, resource constraints, and replication difficulties. Iteration cycles have been compressed from 3–4 years to 1–2 years; multiple technology routes including NPO and CPO are advancing in parallel; production scale is expanding from tens of millions to hundreds of millions of units, while prices decline by approximately 50% every two years on average. Relying solely on equipment accumulation is no longer sufficient to balance efficiency and consistency. Industry demand is shifting toward rapid achievement of large-scale batch delivery.
Targeting optical module manufacturing scenarios, Bozhon Semiconductor, leveraging the synergistic accumulation of Bozhon Precision Industry and Zhongnan Hongsi, provides both core process equipment and domestic and international complete-line, complete-factory batch delivery capabilities. In the optical module back-end assembly scenario, Bozhon Semiconductor has developed an automated solution covering multiple processes including automatic loading, precision dispensing, PCBA assembly, upper cover assembly, automatic screwing, and finished product unloading, achieving continuous multi-station linkage and stable production. The complete line adopts a modular and standardized design, flexibly configurable according to product structure, process route, and capacity requirements:
The designed capacity of the complete line can reach 500 PCS/H, with equipment yield ≥99.5%, meeting the large-scale production requirements of high-speed optical modules;
Integrated CCD visual positioning and automatic deviation correction, with precision dispensing achieving a minimum single-point dispensing volume of 0.03 mg and a minimum single-point diameter of 0.3 mm;
Standardized carrier positioning design, balancing assembly precision and product protection;
Joint presentation enables the optical module production line to "run smoothly" in the digital world first.
At this year's Industrial Fair, the automated production line of Bozhong Semiconductor conducted a full-process simulation using Siemens' digital twin software. The Siemens AF standardization framework, Eigen AI-assisted engineering, and Process Simulate virtual debugging capabilities were deeply integrated with Bozhong's equipment R&D workflow. Through a closed-loop process of "standardized design of structural modules - standard architecture of software programs - AI generation - digital twin virtual verification - rapid installation and commissioning - replication and expansion", the debugging problems that originally occurred on the customer's site were solved in the digital world in advance. For customers, this also means shorter debugging cycles and more stable program consistency.
Three-party Dialogue at the Exhibition Stand: The Manufacturing Secrets of AI Servers and Optical Modules
During the exhibition, Zhang Genfu, the deputy general manager of Bozhong Semiconductor, together with a Siemens industry expert and a Foxconn guest, held a three-party dialogue at the Siemens exhibition stand on "AI Servers and Optical Module Manufacturing". Focusing on the manufacturing challenges brought by the AI server wave, they jointly explored the capability path of "standardization as the foundation, digital twin verification, and AI optimization". Although the three parties were located in different positions such as equipment delivery, industrial technology, and terminal manufacturing, they reached a consensus - first, standardization is used to consolidate engineering assets, then digital twins are used to shift risks forward, and finally, industrial AI forms a closed loop of prediction and optimization based on trusted data.
From the virtual simulation of a single production line to a deep cross-enterprise dialogue, this joint presentation by Bozhong Semiconductor and Siemens points to the same trend: The large-scale manufacturing of optical modules is shifting from "a competition of the precision of individual equipment" to "the replication of the engineering capabilities of the entire production line".
In the future, Bozhong Semiconductor will continue to build on its precision assembly and automation capabilities, and work closely with industry partners, to provide more stable and efficient manufacturing support for high-speed interconnection in the AI era.
